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Products: Solder Paste Inspection

Tecnicon provides an extensive series of bench top non-contact measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.

From the innovative Z-Check 3D through to the entry level Z-Check 100  the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.

Z-Check 3D

The Z-Check 3D is a highly accurate bench top 3D SPI inspection machine where accurate volumetric measurements are of prime importance

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Z-Check 900S

The Z-Check 900S is a fully programmable, automated, 2D non-contact SPI measurement system.

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Z-Check 600/600S

The Z-Check 600/600S is another 2D SPI inspection machine but features the innovative Maglok table giving the operator hands free operation of the PCB. The 600s includes a Laser spot for specific solder pad identification.

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Z-Check 100

The Z-Check 100 is our entry level 2D SPI inspection machine. It's simple to use that can be quickly installed with minimal disruption.

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For a no obligation demonstration or to ask any questions...

Get in touch