Tecnicon provides an extensive series of bench top non-contact measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.
From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
The Z-Check 3D is a highly accurate bench top 3D SPI inspection machine where accurate volumetric measurements are of prime importance
The Z-Check 900S is a fully programmable, automated, 2D non-contact SPI measurement system.
The Z-Check 600/600S is another 2D SPI inspection machine but features the innovative Maglok table giving the operator hands free operation of the PCB. The 600s includes a Laser spot for specific solder pad identification.
The Z-Check 100 is our entry level 2D SPI inspection machine. It's simple to use that can be quickly installed with minimal disruption.
For a no obligation demonstration or to ask any questions...
For a no obligation demonstration or to ask any questions...